2027 2nd International Conference on Computational Mechanics and Smart Systems
2027 2nd International Conference on Advanced Electronic Materials and Device Applications (AEMDA 2027)
July 16–18, 2027 | Chengdu, China

Organized by the University of Electronic Science and Technology of China, the 2nd International Conference on Advanced Electronic Materials and Device Applications (AEMDA 2027) aims to bring together leading scholars, engineers, and industry professionals from around the world to exchange recent advances and insights in electronic materials, device technologies, and emerging applications.

AEMDA 2027 will focus on frontier research and applications including advances in semiconductor and emerging materials, progress in micro/nano fabrication, innovations in device design and modeling, and the development of circuits, sensors, photonic components, and smart electronic systems. The conference seeks to promote cross-disciplinary discussion and highlight research that drives the evolution of next-generation electronic technologies, emphasizing materials–device integration, system-level innovation, and real-world applications.

Through keynote speeches, technical presentations, and networking activities, AEMDA 2027 will provide a high-level international platform for knowledge exchange and collaboration. The conference aims to encourage interdisciplinary research, address emerging scientific and engineering challenges, and foster cooperation between academia and industry, contributing to the advancement of advanced electronic materials and device applications.

 

  • 📌 Full Paper Submission Deadline   May 24, 2027
  • 📌 Registration Deadline June 28, 2027
  • 📌 Final Paper Submission Deadline   June 14, 2027
  • 📌 Conference Dates July 5, 2027
REGISTRATION
All the attendees must register in advance in order to participate in conference.
SUBMISSION
Please submit your full paper/abstract to us via the Electronic Submission System.
CALL FOR PAPERS
Submissions should demonstrate innovation, originality, and clear value to the field.

We warmly invite researchers, academics, and industry professionals worldwide to contribute their latest original research, case studies, and practical insights.

Topics of interest for submission include, but are not limited to, the following:

Track One: Advanced Electronic Materials
  • Nanomaterials and Nanotechnology
  • Semiconductor Materials and Devices
  • Electronic Packaging and Interconnection Technology
  • Flexible Electronics and Smart Wearable Devices
  • High-Frequency Electronic Materials and Applications
  • Electronic Ceramics and Catalytic Materials
Track Two: Device Applications
  • Microwave Photonics
  • High-Speed Optoelectronic Devices
  • Novel Two-Dimensional Materials and Devices
  • Mid-Infrared Fiber Lasers
  • Optical Fiber Sensing

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